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  hi-sincerity microelectronics group. spec. no. : ic200903 issued date : 2009.02.12 revised date : page no. : 1/6 H288 hsmc product specification H288 complementary output hall effect sensor ic description H288 is designed to integrate hall sensor with output driver together on the same chip. it is suitable for dual coils brush-less dc motors, dual coils brush-less dc fan, speed measurement, and revolution counting. sip-4l package it includes a bandgap reference voltage source, a hall device, a amplifier, a hysteresis controller and a open-collector output drive capable of sinking up to 300ma current load. an on-chip protection diode is implemented to prevent reverse power fault. H288 has a control circuit to prevent ?dead angle? from logic race condition in dc fan. it has excellent characteristic of temperature compensation. the internal tem perature compensated voltage source can le t sensor to get uniform sensitivity in a wide temperature range. it is rated for operation over temperature rage from -20oc to +85oc and voltage ranges from 3.0v to 20v. features ? on-chip hall sensor ? 3.0v to 20v operating voltage ? internal temperature compensation ? special design providing logic race condition immunity , shorter switching time, and good switch reliability ? 300ma output sink current ? internal on-chip protection diode ? sip-4l package applications ? dual-coil brush-less dc motor ? dual-coil brush-less dc fan ? revolution counting ? speed measurement pin assignment name p/i/o pin # description vcc p 1 power supply input do o 2 output pin dob o 3 output pin ax277 1234 gnd p 4 ground H288 typical application circuit (brush-less dc fan) ax277 H288 c1 c2 + - vcc coil1 coil2 1234
hi-sincerity microelectronics group. spec. no. : ic200903 issued date : 2009.02.12 revised date : page no. : 2/6 H288 hsmc product specification block diagram temperature compensation voltage regulator logic control vcc hall effect sensor differential amplifier hysteresis control output driver vout2 gnd vout1 gnd test circuit ax277 1234 14v cl1 cl2 rl1 rl2 vout1 vout2 H288 rl1=rl2=820 cl1=cl2=20pf absolute maximum ratings (ta=25 o c) characteristics symbol values unit supply voltage v cc 20 v output breakdown voltage v out(breakdown) 35 v magnetic flux density b unlimited output zener breakdown v z 28 v output on current (continuous) i c 300 ma maximum output current i cmax 1 a operating temperature range t a -20 to +85 o c storage temperature range t s -65 to +150 o c package power dissipation p d 500 mw maximum junction temperature t j 175 o c
hi-sincerity microelectronics group. spec. no. : ic200903 issued date : 2009.02.12 revised date : page no. : 3/6 H288 hsmc product specification electrical characteristics (t=+25 o c, v cc =3v~20v) characteristic symbol test conditions min. typ. max. units supply voltage v cc 3 - 20 v v cc =3v, i l =100ma - 200 - output saturation voltage v ce(sat) v cc =14v, i l =300ma - 300 600 mv output leakage current icex vce=14v, v cc =14v - - 2 ua supply current iccq v cc =20v, output open - 10 18 ma output rise time tr v cc =14v, r l =400 , c l =20pf - 1 5 us output falling time tf v cc =14v, r l =400 , c l =20pf - 0.2 1.2 us magnetic characteristics a grade characteristic symbol min. typ. max. units operate point b op - - 70 g release point b rp -70 - - g hysteresis window bhy - 70 - g b grade characteristic symbol min. typ. max. units operate point b op - - 90 g release point b rp -90 - - g hysteresis window bhy - 70 - g c grade characteristic symbol min. typ. max. units operate point b op - - 130 g release point b rp -130 - - g hysteresis window bhy - 70 - g
hi-sincerity microelectronics group. spec. no. : ic200903 issued date : 2009.02.12 revised date : page no. : 4/6 0 brp n bop s bhy turn on vcc turn off on-state vo u t magnetic flux density (gauss) 0 brp n bop s bhy on-state vsat vo u t magnetic flux density (gauss) H288 hysteresis characteristics curve vsat off-state vcc off-state turn off turn on do dob characteristics curve H288 hsmc product specification supply current & supply voltage 0 2 4 6 8 10 12 14 16 2.8 3 3.5 3.6 4 5 6 7 8 9 10 12 14 16 18 20 supply voltage (v) supply current (ma) ... supply current & temperature 12.4 12.5 12.6 12.7 12.8 12.9 13 13.1 13.2 13.3 13.4 0 20 40 60 80 100 120 temperature ( o c) supply current (ma) ... test conditions: v cc =20v output open, r l = (refer to test circuit) test conditions: v cc =2.8v~20v output open, r l = t a =25 o c (refer to test circuit) hysteresis & temperature 0 10 20 30 40 50 60 70 80 0 20 40 60 80 100 120 temperature ( o c) hysteresis (g) sip-4l power dissipation & temperature 200 250 300 350 400 450 500 550 600 0 20406080100120 temperature ( o c) power dissipation (mw) test conditions: v cc =14v, r l =400 ? c l =20pf (refer to test circuit)
hi-sincerity microelectronics group. spec. no. : ic200903 issued date : 2009.02.12 revised date : page no. : 5/6 H288 hsmc product specification brush-less dc fan output current curve 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 time (us) current (ma) 180 90 0 ic oil 1 ic oil 2 12v, 0.24a brush-less dc fan (refer to typical application circuit) test conditions: v cc =12v, c 1 =c 2 =2.2uf r coil1 =r coil2 =40ohm brush-less dc fan output voltage curve 0 2 4 6 8 10 12 14 16 18 20 0 2 4 6 8 10121416182 time (ms) output voltage (v) 0 vout 1 vout 2 12v, 0.24a brush-less dc fan (refer to typical application circuit) test conditions: v cc =12v, c 1 =c 2 =2.2uf r coil1 =r coil2 =40ohm
hi-sincerity microelectronics group. spec. no. : ic200903 issued date : 2009.02.12 revised date : page no. : 6/6 H288 hsmc product specification sip-4l dimension dim min. max. a b c a1 a2 d e f g h marking site a1 j i k a2 e 12 34 l marking: a 3.962 4.216 mark h: halogen free 288 b 2.870 3.124 c 13.60 15.60 d 1.245 1.753 e 0.750ref f 0.406 0.508 g 0.330 0.432 h 1.27ref i 1.87 2.13 pin style: 1.vcc 2.do 3.dob 4.gnd j 1.27 1.53 hall sensor location: 2.00m m 1.37m m to p view material: ? lead solder plating: sn/3.0ag/0.5cu or pure-tin (pb-free) ? mold compound: epoxy resin family, flammability solid bu rning class: ul94v-0 *: typical, unit: mm 4-lead sip-4l plastic hsmc package code: ad important notice: ? all rights are reserved. reproduction in whole or in part is prohibited without the prior written approval of avantic. ? hsmc reserves the right to make changes to its products without notice. ? hsmc semiconductor products are not warranted to be suitable for use in life-support applications, or systems. ? hsmc assumes no liability for any consequence of customer produc t design, infringement of patents, or application assistance. head office: ? head office (hi-sincerity microelectronics co rp.): 10f.,no. 61, sec. 2, chung-shan n. rd. taipei taiwan r.o.c. tel: 886-2-25212056 fax: 886-2-25632712, 25368454 ? avantics microelectronics corp: no. 255, cai lun rd. zhang jiang technology industrial park pudong, shanghai, china tel: 86-021-58955599 fax: 86-021-58558038


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